Download Samsung 2GB, DDR II SDRAM, 800MHz, CL6
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General Information DDR2 SDRAM DDR2 SDRAM Product Guide January 2009 Memory Division 1 of 17 January 2009 General Information DDR2 SDRAM A. DDR2 SDRAM Component Ordering Information 1 2 3 4 5 6 7 8 9 10 11 K 4 T X X X X X X X - X X X X SAMSUNG Memory Speed DRAM Temp & Power DRAM Type Package Type Revision Density Bit Organization Interface (VDD, VDDQ) # of Internal Banks 8. Revision 1. SAMSUNG Memory : K M A B C D E F G H Q R 2. DRAM : 4 3. DRAM Type T : DDR2 SDRAM 4. Density 56 : 256Mb 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 9. Package Type Z J H M T 5. Bit Organization 04 06 07 08 16 26 27 :x4 : x 4 Stack : x 8 Stack :x8 : x16 : x 4 Stack (JEDEC Standard) : x 8 Stack (JEDEC Standard) : 1st Gen. : 2nd Gen. : 3rd Gen. : 4th Gen. : 5th Gen. : 6th Gen. : 7th Gen. : 8th Gen. : 9th Gen. : 17th Gen. : 18th Gen. : : : : : FBGA (Lead-free) FBGA DDP (Lead-free) FBGA (Lead-free & Halogen-free) FBGA DDP (Lead-free & Halogen-free) FBGA DSP (Lead-free & Halogen-free, Thin) 10. Temp & Power C : Commercial Temp.( 0°C ~ 95°C) & Normal Power L : Commercial Temp.( 0°C ~ 95°C) & Low Power Y : Commercial Temp.( 0°C ~ 95°C) & Low Voltage 6. # of Internal Banks 3 : 4 Banks 4 : 8 Banks 7. Interface ( VDD, VDDQ) Q : SSTL-1.8V (1.8V, 1.8V) 11. Speed CC : DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3) D5 : DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4) E6 : DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5) F7 : DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6) E7 : DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5) F8 : DDR2-1066(533MHz @ CL=7, tRCD=7, tRP=7) 2 of 17 January 2009 General Information DDR2 SDRAM B. DDR2 SDRAM Component Product Guide Density 512Mb G-die 1Gb Q-die 1Gb E-die 2Gb A-die Banks 4Banks 8Banks 8Banks 8Banks Part Number Package & Power, Temp. (-C/-L) & Speed Org. K4T51043QG HC(L)E7/F7/E6 128M x 4 K4T51083QG HC(L)E7/F7/E6 64M x 8 K4T51163QG HC(L)E7/F7/E6 32M x 16 K4T1G044QQ HC(L)E7/F7/E6 256M x 4 K4T1G084QQ HC(L)E7/F7/E6 128M x 8 K4T1G164QQ HC(L)E7/F7/E6 K4T1G044QE HC(L)E7/F7/E6 256M x 4 K4T1G084QE HC(L)E7/F7/E6 128M x 8 64M x 16 K4T1G164QE HC(L)E7/F7/E6 K4T1G164QE HC(L)F8 K4T2G044QA HC(L)F7/E6 512M x 4 K4T2G084QA HC(L)F7/E6 256M x 8 3 of 17 64M x 16 PKG 60 ball FBGA Avail. Now 84 ball FBGA 60 ball FBGA Now 84 ball FBGA 60 ball FBGA 84 ball FBGA 68 ball FBGA Now Now Feb.’09 Now January 2009 General Information DDR2 SDRAM C. DDR2 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 11 12 13 M X X X T X X X X X X X - X X X X Memory Module AMB Vendor DIMM Type Data bits DRAM Component Type Speed Temp & Power PCB Revision Depth # of Banks in Comp. & Interface Package Bit Organization Component Revision 1. Memory Module : M 8. Component Revision M : 1st Gen. B : 3rd Gen. D : 5th Gen. F : 7th Gen. Q : 17th Gen. 2. DIMM Type 3 : DIMM 4 : SODIMM 3. Data Bits 78 : 91 : 92 : 93 : 95 : 70 : x64 x72 x72 x72 x72 x64 T : DDR2 SDRAM (1.8V VDD) Z J Q H M E 32 : 32M 64 : 64M 28 : 128M 56 : 256M 51 : 512M 1G : 1G 33 65 29 57 52 1K : 32M (for 128Mb/512Mb) : 64M (for 128Mb/512Mb) : 128M (for 128Mb/512Mb) : 256M (for 512Mb/2Gb) : 512M (for 512Mb/2Gb) : 1G (for 2Gb) 6. # of Banks in comp. & Interface 4Banks & SSTL-1.8V 8Banks & SSTL-1.8V 7. Bit Organization : : : : : : : x4 x8 x16 x 4 Stack (JEDEC Standard) x 8 Stack (JEDEC Standard) x 4 Stack x 8 Stack : : : : : : FBGA(Lead-free) FBGA DDP (Lead-free) FBGA QDP (Lead-free) FBGA (Lead-free & Halogen-free) FBGA DDP (Lead-free & Halogen-free) FBGA QDP (Lead-free & Halogen-free) 10. PCB Revision 0 : Mother PCB 2 : 2nd Rev. 4 : 4th Rev. 5. Depth 0 3 4 6 7 8 9 : 2nd Gen. : 4th Gen. : 6th Gen. : 8th Gen. : 18th Gen. 9. Package 240pin Unbuffered DIMM 240pin ECC unbuffered DIMM 240pin VLP Registered DIMM 240pin Registered DIMM 240pin Fully Buffered DIMM 200pin Unbuffered SODIMM 4. DRAM Component Type 5 : 6 : A C E G R 1 3 A S : : : : 1st Rev. 3rd Rev. Parity DIMM Reduced PCB 11. Temp & Power C : Commercial Temp.( 0°C ~ 95°C) & Normal Power L : Commercial Temp.( 0°C ~ 95°C) & Low Power Y : Commercial Temp.( 0°C ~ 95°C) & Low Voltage 12. Speed CC : DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3) D5 : DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4) E6 : DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5) F7 : DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6) E7 : DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5) F8 : DDR2-1066(533MHz @ CL=7, tRCD=7, tRP=7) 13. AMB Vendor For FBDIMM : Intel 5 : IDT 6, 8 3, 4, 9 : Montage Note : PC2-8500(DDR2-1066). PC2-6400(DDR2-800), PC2-5300(DDR2-667) PC2-4200(DDR2-533), PC2-3200(DDR2-400) 4 of 17 January 2009 General Information DDR2 SDRAM D. DDR2 SDRAM Module Product Guide 240Pin DDR2 Unbuffered DIMM Org. Density 64Mx 64 512MB 64Mx 72 128Mx 64 1GB 128Mx 72 256Mx 64 2GB 256Mx 72 512Mx 64 512Mx 72 4GB Internal Banks Rank PKG 4 1 60 ball FBGA Speed M378T6553GZS CE7/F7/E6 64M x 8 * 8pcs 512Mb G-die M378T6464QZ(H)3 CE7/F7/E6 64M x 16 * 4pcs 1Gb Q-die M378T6464EHS CE7/F7/E6 64M x 16 * 4pcs 1Gb E-die M391T6553GZ3 CE7/F7/E6 64M x 8 * 9pcs 512Mb G-die 4 1 64M x 8 * 16pcs 512Mb G-die 4 2 8 1 M378T2953GZ3 CE7/F7/E6 M378T2863QZ(H)S CE7/F7/E6 M378T2863EHS CE7/F7/E6 M378T2863EHS CF8 M391T2953GZ3 CE7/F7/E6 M391T2863QZ(H)3 CE7/F7/E6 M391T2863EH3 CE7/F7/E6 M378T5663QZ(H)3 CE7/F7/E6 M378T5663EH3 CE7/F7/E6 M378T5663EH3 CF8 M391T5663QZ(H)3 CE7/F7/E6 M391T5663EH3 CE7/F7/E6 Composition Comp. Version Part Number 1Gb 128M x 8 * 8pcs 1Gb 64M x 8 * 18pcs 512Mb 128M x 8 * 18pcs 128M x 8 * 16pcs 128M x 8 * 18pcs 1 1 84 ball FBGA Avail. 30mm Now 60 ball FBGA Q-die E-die G-die 1Gb Q-die 1Gb E-die 1Gb Q-die 1Gb E-die 1Gb Q-die 1Gb E-die M378T5263AZ(H)3 CF7/E6 256M x 8 * 16pcs 2Gb A-die M391T5263AZ(H)3 CF7/E6 256M x 8 * 18pcs 2Gb A-die 5 of 17 8 Height Now 60 ball FBGA 4 2 8 1 30mm Feb. ’09 Now Now 8 2 60 ball FBGA 30mm Feb. ’09 Now 8 2 68 ball FBGA 30mm Now January 2009 General Information DDR2 SDRAM 200Pin DDR2 SODIMM Org. 64Mx 64 128Mx 64 Density Part Number Speed M470T6554GZ3 C(L)E7/F7/E6 512MB M470T6464QZ(H)3 1GB 256Mx 64 2GB 512Mx 64 4GB C(L)E7/F7/E6 M470T6464EHS C(L)E7/F7/E6 M470T2953GZ3 C(L)E7/F7/E6 M470T2864QZ(H)3 C(L)E7/F7/E6 M470T2864EH3 C(L)E7/F7/E6 M470T2863EH3 C(L)E7/F7/E6 M470T5663QZ(H)3 C(L)E7/F7/E6 M470T5663EH3 C(L)E7/F7/E6 M470T5267AZ(H)3 C(L)F7/E6 Composition 32M x 16 * 64M x 16 * 64M x 8 8pcs 4pcs * 16pcs 64M x 16 * 8pcs 128M x 8 * 128M x 8 * 16pcs st.512M x 8 * 6 of 17 8pcs 8pcs Comp. Version 512Mb G-die 1Gb Q-die 1Gb E-die 512Mb G-die 1Gb Q-die 1Gb E-die 1Gb Q-die 1Gb E-die 2Gb A-die Internal Banks Rank 4 2 8 1 4 2 60 ball FBGA 2 84 ball FBGA 1 60 ball FBGA 8 8 2 8 2 PKG Height Avail. 84 ball FBGA 30mm Now 30mm Now 30mm Now 30mm Now 60 ball FBGA 83 ball FBGA January 2009 General Information DDR2 SDRAM 240Pin DDR2 Registered DIMM Org. Density 64Mx 72 512MB 128Mx 72 256Mx 72 512Mx 72 1Gx 72 1GB 2GB 4GB 8GB Part Number Speed M393T6553GZ3 CD5/CC M393T6553GZA CF7/E6 M393T2953GZ3 CD5/CC M393T2953GZA CF7/E6 M393T2950GZ3 CD5/CC M393T2950GZA CF7/E6 M393T2863QZ3 CD5/CC M393T2863QZA CE7/F7/E6 M393T2863QHA CE6/F7/E7 M393T5750GZ3 CD5/CC M393T5750GZA CF7/E6 M393T5663QZ3 CD5/CC M393T5663QZA CF7/E6 M393T5663QHA CE6/F7/E7 M393T5660QZ3 CD5/CC M393T5660QZA CE7/F7/E6 M393T5660QHA CE6/F7/E7 M393T5160QZ3 CD5/CC M393T5160QZA CE7/F7/E6 M393T5160QHA CE6/F7/E7 M393T5260AZA CF7/E6 M393T1G60QJA CE6/D5 M393T1G60QMA CE6/D5 M393T1K66AZA CF7/E6 Composition 64M x 8 * 9pcs Comp. Version Internal Banks Rank PKG Height Avail. 1 60 ball FBGA 30mm Now 60 ball FBGA 30mm 512Mb G-die 4 512Mb G-die 4 64M x 8 * 18pcs 2 128M x 4 * 18pcs 128M x 8 * 9pcs 1 1Gb Q-die 8 Now 1 2Q. ’09 128M x 4 * 36pcs 512Mb G-die 4 2 Now 128M x 8 * 18pcs 2 1Gb Q-die 60 ball FBGA 30mm 8 256M x 4 * 18pcs 2Q. ’09 Now 1 2Q. ’09 256M x 4 * 36pcs 1Gb Q-die 2 60 ball FBGA 8 512M x 4 * 18pcs 2Gb A-die 1 68 ball FBGA DDP 512M x 4 * 36pcs 1Gb Q-die 4 63 ball FBGA st.1G x 4 * 18pcs 2Gb A-die 2 83 ball FBGA 8 7 of 17 Now 30mm 2Q. ’09 Now Now 30mm 2Q. ’09 Now January 2009 General Information DDR2 SDRAM 240Pin DDR2 VLP Registered DIMM Internal Banks Rank PKG Height Avail. G-die 4 1 60 ball FBGA 18.3mm Now 512Mb G-die 4 1 1Gb Q-die 8 1 60 ball FBGA 18.3mm Density Part Number Speed 64Mx 72 512MB M392T6553GZA CF7/E6 64M x 8 * 9pcs 512Mb M392T2950GZA CF7/E6 128M x 4 * 18pcs 128Mx 72 1GB M392T2863QZA CF7/E6 M392T2863QHA CF7/E6 128M x 8 * 9pcs 256Mx 72 2GB 512Mx 72 4GB 1Gx 72 8GB M392T5660QZA CF7/E6 M392T5660QHA CF7/E6 M392T5663QZA CF7/E6 M392T5663QHA CF7/E6 Composition Comp. Version Org. 256M x 4 * 18pcs Q-die M392T5160QJA CF7/E6 CF7/E6 M392T1G60QQA CE6/D5 QDP 1G x 4 * 18pcs M392T1G60QEA CE6/D5 QDP 1G x 4 * 18pcs DDP 512M x 4 * 18pcs 8 of 17 Now 60 ball FBGA 8 128M x 8 * 18pcs M392T5160QMA 2Q. ’09 1 1Gb Now 18.3mm 2 2Q. ’09 Now 2Q. ’09 1Gb Q-die 8 2 63 ball FBGA 18.3mm 1Gb Q-die 8 4 65 ball FBGA 18.3mm Now 2Q. ’09 Now 2Q. ’09 January 2009 General Information DDR2 SDRAM 240Pin DDR2 Fully Buffered DIMM(1.8V) Org. Density Part Number 64Mx 72 512MB M395T6553GZ4 M395T2953GZ4 M395T2863QZ4 128Mx 72 Speed AMB CE7/F7/E6 6 : IDT C1 CE6 5 : Intel D1 CE7/F7/E6 6 : IDT C1 CE6 5 : Intel D1 CE7/F7/E6 6 : IDT C1 CE7/F7/E6 8: IDT L4 CE6 1GB CE7/F7/E6 M395T2863QH4 CE7/F7/E6 CE6 M395T5750GZ4 M395T5663QZ4 256Mx 72 M395T5663QH4 6 : IDT C1 CE7/F7/E6 8: IDT L4 CE6 CE6 512Mx 72 4GB M395T5160QH4 CE7/F7/E6 M395T1G60QJ4 1Gx 72 8GB M395T1G60QM4 M395T1K66AZ4 G-die 4 1 64M x 8 * 18pcs 512Mb G-die 4 2 60 ball FBGA Height Avail. 30.35mm Now Now 60 ball 128M x 8 * 9pcs 1Gb Q-die 8 1 FBGA 30.35mm 2Q. ’09 128M x 4 * 36pcs 512Mb G-die 4 2 Now 60 ball 128M x 8 * 18pcs 1Gb Q-die 8 2 FBGA 30.35mm 8: IDT L4 2Q. ’09 9: Montage D1 6 : IDT C1 8: IDT L4 Now 5 : Intel D1 9: Montage D1 8: IDT L4 M395T5163QH4 512Mb PKG 5 : Intel D1 CE6 CE7/F7/E6 M395T5263AZ4 6 : IDT C1 6 : IDT C1 M395T5163QZ4 9pcs 5 : Intel D1 9: Montage D1 CE7/F7/E6 CE6 Rank 9: Montage D1 CE7/F7/E6 CE7/F7/E6 Banks 8: IDT L4 6 : IDT C1 CE7/F7/E6 Internal 5 : Intel D1 5 : Intel D1 CE6 M395T5160QZ4 6 : IDT C1 CE6 CE7/F7/E6 64M x 8 * Comp. Version 5 : Intel D1 9: Montage D1 CE7/F7/E6 CE6 2GB Composition 256M x 4 * 36pcs 2 1Gb Q-die FBGA 8 5 : Intel D1 60 ball 30.35mm 2Q. ’09 9: Montage D1 8: IDT L4 CF7/E6 6 : IDT C1 CF7/E6 8: IDT L4 CE6/F7 8: IDT L4 CF7/E6 8: IDT L4 CF7/E6/D5 6 : IDT C1 CF7/E6 8: IDT L4 128M x 8 * 36pcs 256M x 8 * 18pcs 2Gb A-die 2 DDP 512M x 4 * 36pcs 1Gb Q-die 4 8 st.1G x 4 * 18pcs 9 of 17 Now 4 2Gb A-die 2 2Q. ’09 68 ball Now FBGA 63 ball FBGA 83 ball FBGA Now 30.35mm 2Q. ’09 Now January 2009 General Information DDR2 SDRAM 240Pin DDR2 Fully Buffered DIMM(1.55V) Org. Density 128Mx 72 1GB 256Mx 72 2GB 512Mx 72 1Gx 72 4GB 8GB Part Number Speed AMB M395T2863QZ4 YE6 8: IDT L4 M395T2863QH4 YE6 8: IDT L4 M395T5663QZ4 YE6 8: IDT L4 M395T5663QH4 YE6 8: IDT L4 M395T5160QZ4 YE6 8: IDT L4 Composition Comp. Internal Version Banks Rank 64M x 8 * 18pcs 1Gb Q-die 8 1 128M x 8 * 18pcs 1Gb Q-die 8 2 256M x 4 * 36pcs 2 M395T5160QH4 YE6 8: IDT L4 M395T5163QZ4 YE6 8: IDT L4 M395T5163QH4 YE6 8: IDT L4 M395T5263AZ4 YE6 8: IDT L4 256M x 8 * 18pcs 2Gb A-die M395T1K66AZ4 YE6 8: IDT L4 st.1G x 4 * 18pcs 2Gb A-die 1Gb Q-die 128M x 8 * 36pcs 10 of 17 8 4 2 8 2 PKG 60 ball FBGA 60 ball FBGA Height 30.35mm 30.35mm Avail. Now 2Q. ’09 Now 2Q. ’09 Now 60 ball FBGA 2Q. ’09 30.35mm 68 ball Now FBGA 83 ball FBGA Now 2Q. ’09 30.35mm Now January 2009 General Information DDR2 SDRAM 9.00 ± 0.10 0.10MAX 60Ball FBGA for 512Mb E-die (x4/x8) A 0.80 x 8 = 6.40 3.20 0.80 9 (Datum A) 8 7 6 5 #A1 B 4 3 9.00 ± 0.10 # A1 INDEX MARK 1.60 2 1 A B 0.80 H J 4.00 F G 11.00 ± 0.10 E 11.00 ± 0.10 D 0.80 x 10 = 8.00 0.80 (Datum B) C K L (0.95) 60-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0.35 ± 0.05 MOLDING AREA (1.90) 1.10 ± 0.10 0.2 M A B Bottom Top 9.00 ± 0.10 0.10MAX 84Ball FBGA for 512Mb E-die (x16) A 0.80 x 8 = 6.40 3.20 0.80 9 (Datum A) 8 7 1.60 6 5 4 #A1 B 3 9.00 ± 0.10 # A1 INDEX MARK 2 1 A B 0.80 C D H 0.80 J K 5.60 L 13.00 ± 0.10 0.80 x 14 = 11.20 F G 13.00 ± 0.10 (Datum B) E M N P R (0.95) 84-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0.2 M A B (1.90) 0.35 ± 0.05 MOLDING AREA 1.10 ± 0.10 Bottom 11 of 17 Top January 2009 General Information DDR2 SDRAM 7.50 ± 0.10 A 0.80 x 8 = 6.40 0.80 7.50 ± 0.10 # A1 INDEX MARK 1.60 #A1 B 9 8 7 6 5 4 0.10MAX 60Ball FBGA for 512Mb G-die (x4/x8) 3 2 1 (Datum A) A (Datum B) B 0.80 H 0.50 ± 0.05 F G 9.50 ± 0.10 E 9.50 ± 0.10 D 0.80 x 10 = 8.00 C J K L (0.95) ∅0.2 M 0.35±0.05 (1.90) 60-∅0.45±0.05 1.10±0.10 MOLDING AREA A B 7.50 ± 0.10 A 0.80 x 8 = 6.40 9 (Datum A) 8 7 1.60 6 5 4 B 3 7.50 ± 0.10 # A1 INDEX MARK 3.20 0.80 0.10MAX 84Ball FBGA for 512Mb G-die (x16) 2 #A1 1 A B (Datum B) C D 0.80 J K 5.60 L 0.50±0.05 H 12.50 ± 0.10 0.80 x 14 = 11.20 F G 12.50 ± 0.10 E M N P R 0.35±0.05 (0.95) 84-∅0.45±0.05 ∅0.2 M (1.90) 1.10±0.10 MOLDING AREA A B 12 of 17 January 2009 General Information DDR2 SDRAM 11.00 ± 0.10 0.10MAX 60Ball FBGA for 1Gb C-die (x4/x8) 11.00 ± 0.10 # A1 INDEX MARK 6.40 9 8 7 #A1 1.60 0.80 (Datum A) 6 5 4 3 2 1 A B 0.80 (Datum B) C F G 4.00 H 1.60 J 11.50 ± 0.10 8.00 E 11.50 ± 0.10 D K L 0.35 ± 0.05 MAX.1.10 60-∅0.45±0.05 (Post reflow 0.50 ± 0.05) 0.2 M A B (0.95) (1.90) MOLDING AREA Top Bottom 13 of 17 January 2009 General Information DDR2 SDRAM 9.00 ± 0.10 # A1 INDEX MARK 0.10MAX 60Ball FBGA for 1Gb D-die (x8) 9.00 ± 0.10 6.40 0.80 (Datum A) 9 8 7 #A1 1.60 6 5 4 3 2 1 A B 0.80 (Datum B) C F G 4.00 H 11.00 ± 0.10 8.00 E 11.00 ± 0.10 D 1.60 J K L 0.35 ± 0.05 MAX.1.10 60-∅0.45±0.05 (Post reflow 0.50 ± 0.05) (0.95) (1.90) 0.2 M A B Top Bottom 9.00 ± 0.10 0.10MAX 84Ball FBGA for 1Gb D-die (x16) 9.00 ± 0.10 # A1 INDEX MARK 6.40 0.80 #A1 1.60 (Datum A) 9 8 7 6 5 4 3 2 1 A 0.80 B C (Datum B) D E 13.00 ± 0.10 F H J K 5.60 L M 13.00 ± 0.10 11.20 G 1.60 N P R 0.35 ± 0.05 MAX.1.20 (0.95) 84-∅0.45±0.05 (Post reflow 0.50 ± 0.05) 0.2 M A B (1.90) Top Bottom 14 of 17 January 2009 General Information DDR2 SDRAM 0.10MAX 60Ball FBGA for 1Gb Q-die (x4/x8) # A1 INDEX MARK 9.00 ± 0.10 A 0.80 x 8 = 6. 40 0.80 9 8 7 1.60 6 5 4 B 3 2 9.00 ± 0.10 #A1 1 A B C 0.50±0.05 0.80 H 11.00 ± 0.10 F G 11.00 ± 0.10 E 0.80 x 10 = 8.00 D 1.60 J K L 0.35±0.05 (0.95) (1.90) 1.10±0.10 Bottom Top 0.10MAX 84Ball FBGA for 1Gb Q-die (x16) # A1 INDEX MARK 9.00 ± 0.10 A 0.80 x 8 = 6. 40 0.80 9 8 7 9.00 ± 0.10 1.60 6 5 4 B 3 2 #A1 1 A B C D 0.50±0.05 0.80 J K 13.00 ± 0.10 H 13.00 ± 0.10 F G 0.80 x 14 = 11.20 E L M 1.60 N P R (0.95) 0.35±0.05 (1.90) Bottom Top 15 of 17 1.10±0.10 January 2009 General Information DDR2 SDRAM 7.50 ± 0.10 A 0.80 x 8 = 6. 40 # A1 INDEX MARK 3.20 (Datum A) 0.80 9 8 7 0.10MAX 60Ball FBGA for 1Gb E-die (x4/x8) 1.60 6 5 4 B 3 2 7.50 ± 0.10 #A1 1 A B 0.80 x 10 = 8.00 D E 0.80 H J 4.00 F G 9.50 ± 0.10 C 9.50 ± 0.10 0.80 (Datum B) K L 0.35±0.05 (0.95) MOLDING AREA 1.10±0.10 (1.90) 60-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0.2 M A B 7.50 ± 0.10 A 0.80 x 8 = 6. 40 # A1 INDEX MARK 3.20 0.80 9 (Datum A) 8 7 0.10MAX 84Ball FBGA for 1Gb E-die (x16) 1.60 6 5 4 B 3 2 7.50 ± 0.10 #A1 1 A B C D H 0.80 J K 4.00 L 12.50 ± 0.10 F G 12.50 ± 0.10 E 0.80 x 14 = 11.20 0.80 (Datum B) M N P R (0.95) 84-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0.35±0.05 MOLDING AREA (1.90) 1.10±0.10 0.2 M A B 16 of 17 January 2009 General Information DDR2 SDRAM 68Ball FBGA for 2Gb A-die (x4/x8) 11.00 ± 0.10 #A1 0.80 x 8 = 6.40 3.20 11.00 ± 0.10 # A1 INDEX MARK 1.60 0.80 9 8 7 6 5 4 3 2 1 0.10MAX (Datum A) A B C (Datum B) D 7.20 E F L 0.80 M N 18.00 ± 0.10 J K 18.00 ± 0.10 8.00 H 0.80 x 18 = 14.40 G P R T U V W (0.95) 68-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) (1.90) 0.35 ± 0.05 1.10 ± 0.10 MOLDING AREA 0.2 M A B Bottom Top 17 of 17 January 2009